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ASI Epoxy Adhesives
The MP 5400 SERIES offers a complete line of one and two part epoxies for structural bonding, potting, and encapsulating applications. These products offer engineers maximum design versatility by providing the following features and benefits:

- Superior bond strengths
- Dependable performance
- Excellent aging and weathering properties
- Good impact and vibration resistance
- Good resistance to high temperature and humidity
- Versatile, bonds a wide range of similar and dissimilar materials
- Cure at room temperature or can be accelerated with heat
- Solvent free
- Good gap filling characteristics
- Wide range of products that provide cure speeds, viscosities, and performance properties, to meet specific requirements
- Improves finished product quality
- Replaces mechanical fastening devices
- Lowers cost
 
ASI MP 5405 Epoxy Adhesive

ASI MP 5405BK Epoxy Adhesive

ASI MP 54460 Epoxy Adhesive

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