Tecbond 501 Foundry Adhesive


Manufactured by Power Adhesives LTD., this hot melt adhesive is comprised of 100% solids, containing no solvents or water.

Specifically formulated for instant bonding of foundry cores, Tecbond 501 has a low viscosity for easy flow and can tolerate temperatures to 145-150┬░ F. Each rigid stick is 1 3/4" in diameter and 1 5/8" long for maximum glue flow. Each stick has the product number and batch number clearly printed for quality control purposes. The Tec 3200 Industrial Duty Dispensing Gun must be used to dispense this glue. This material is sold in 22 lb. boxes.

Related Products & Accessories


Catalog Number Description   Qty  
176071 Hot Melt Adhesive Tecbond 501

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